Heatsinks for BGA
For heat dissipation from integrated circuits of the type BGA and similar, Fischer Elektronik have designed special heatsinks. Heatsinks with heights of 6 mm and 10 mm have been optimised to suit these BGA circuits with dimensions between 10x10 mm and 42x45 mm. The shape of the pin fins allows efficient heat dissipation with free convection, especially in the case of moving air, and the geometry of the heatsinks efficiently furthers multi-directional air flow. Installation on the BGA boards is made using either thermally conductive adhesive or special, thermally conductive foil cut to size, which is self-adhesive on both sides. In addition to the standard range of heatsinks, special processing and special designs to meet customers' specifications are possible.