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Board Level heatsinks

157 - 161 (161)Number:
fk252sa220h.tif

horizontal mounting, for semiconductor-design TO 220

* = touch in edge of transistor

fk252sa220v_vl.tif

vertical mounting, for semiconductor-design TO 220

* = touch in edge of transistor

fk253_schatten.jpg

vertical mounting, for semiconductor-design TO 222

* = touch in edge of transistor

fk255_schatten.jpg

vertical mounting, for semiconductor-design TO 222

* = touch in edge of transistor

fk257_schatten.jpg

vertical mounting, for semiconductor-design TO 222

* = touch in edge of transistor

157 - 161 (161)Number:
Discrete electronic devices (transistors) in its corresponding housing such as TO 3, TO 5, TO 220, TO 247 and plenty more are used in many electronic circuits. The heat dissipation of those devices can succeed easily and good by means of so-called finger shaped heatsinks. The naming finger shaped heatsink is caused by its form which reminds to a hand with opened or spread fingers.

Different materials and sizes for finger shaped heatsinks
Usually finger shaped heatsinks are made of aluminium, either as a die cast part or as a formed sheet – and also, due to the device miniaturization and herewith causing heat dissipation problematic more and more made of copper. Different sizes of the finger shaped heatsinks with the resulting different heat dissipation possibilities show the best results by considering the mounting condition in the specific application. For this reason Fischer Elektronik has got a wide range of different sizes, forms and mounting possibilities and is therefore best-positioned as a qualified partner for finger shaped heatsinks. For more small devices are also available: clip-on heatsinks, miniature heatsinks as well as copper heatsinks for D PAK and more.

The range of heatsinks also comprises - beside board level heatsinks - heatsinks and fan-coolers for processors, profile- and fluid heatsinks, cooling aggregates as well as corresponding accessory.

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