GAP-Filler, Heat conductive foam and gel foils |
Thermally conductive silicon foam foils
GAP-Filler, Heat conductive foam and gel foils
WSF ...
WSF 635
- elastomer foam with closed cell structure
- good heat conductor e.g. between components, heatsinks and casing parts
- electrical insulating
- can be compressed even with a low contact pressure
- absorbs shocks and vibrations
Thermal resistance at 3.2 mm material thickness:
compression [%] | contact | 10 | 25 | 50 |
contact pressure [psi] | >1 | 5 | 12 | 34 |
Rth [K/W] (1 in2 x 3.2 mm) | 6 | 4.5 | 2.5 | 1 |
heat conductivity [W/mK] | 0.3 | 0.4 | 0.45 | 0.65 |
- WSFS 635 double sided adhesive and WSF self-adhesive upon request
- according to NASA gas emission requirements
- density:1.105 g/cm3
- temperature range:-62°C ... +205°C
- compression, 25%:18 psi
- elongation:150 %
- tear strength:120 psi
- dielectric strength:100 V/mm
- class of inflammability:UL 94 V-1 (at thickness ≥3.2mm)
material: | foam film
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material thickness: | 6.35±1,200 mm
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version: | non adhesive
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colour: | green
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density: | 1.105 g/cm3
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hardness: | 13 Shore A
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temperature range: | -62°C ... +205°C
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compression, 25%: | 18 psi
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elongation: | 150 %
|
tear strength: | 120 psi
|
dielectric strength: | 100 V/mm
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class of inflammability: | UL 94 V-1 (at thickness ≥3.2mm)
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type of delivery: |
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FRI 7:30 - 15:15